Home > Products > PPTC Fuse > Surface Mount Resettable PPTC Fuse > PPTC Resettable Surface Mount Fuse

PPTC Resettable Surface Mount Fuse

Brand : Songshan

Product origin : Shanghai

Delivery time : 7-15 days

Supply capacity : 15000000

Basic Info

Model No.: LP-SM

Breaking Capacity: Low

Type: Current Fuse

Usaga: Low Voltage

Shape: SMD

Fusing Speed: F


Additional Info


Packaging: Carton

Brand: Songshan

Transportation: Ocean,Land,Air

Place of Origin: Shanghai,China


Product Description


LP-SM is a resettable fuse, which is a kind of electronic over current protection component. Like its name, the fuse can be used repeatedly in circuit. The fuse adopts high-molecular organic polymer at a high temperature and high pressure condition and the conductive particle material is added, then the fuse is made through a special process. The fuse can be automatically restored to continue to play a role in protection of circuit after it fuses in the circuit and thus the fuse plays an important role the general fuse cannot play. The right specification of the fuse depends on conditions of use.


Features

  • Customized size and electrical characteristic available

  • Surface mount packaging for automated assembly

  • Fast tripping resettable circuit protection 

Product Dimensions for Surface-mounted Devices 

Unit: mm


Part number


Dimension





A

B

C

D

E

Figures for

Max.

Max.

Max.

Min.

Min.

 Dimension

LP-SM050

7.98

3.18

5.44

0.50

-

Fig.1

LP-SM110

7.98

3.18

5.44

0.50

-

Fig.1

LP-SM150C

7.98

5.44

1.25

0.80

0.30

Fig.2

LP-SM200C/24

7.98

5.44

1.50

0.80

0.30

Fig.2

LP-SM300C/16

7.98

5.44

1.50

0.80

0.30

Fig.2

LP-SM400C/16

7.98

5.44

2.00

0.80

0.10

Fig.2





 10 amp radial lead fuse                      12 amp radial lead fuse


Thermal Derating Chart-IH(A)

Part number

 

Hold current

-40℃

-20℃

0℃

25℃

40℃

50℃

60℃

70℃

85℃

LP-SM050

0.80

0.71

0.59

0.50

0.44

0.38

0.32

0.26

0.19

LP-SM110

1.75

1.54

1.32

1.10

0.96

0.83

0.73

0.61

0.42

LP-SM150

2.40

2.09

1.81

1.50

1.33

1.06

1.01

0.83

0.59

LP-SM200C/24

3.18

2.80

2.45

2.00

1.76

1.45

1.32

1.11

0.79

LP-SM300C/16

4.76

4.21

3.66

3.00

2.61

2.21

2.05

1.69

1.17

LP-SM400C/16

6.35

5.63

4.86

4.00

3.46

2.95

2.72

2.24

1.53



Electrical Characteristics at 25℃                                       

Part number

 

IH

IT

Vmax

Imax

Max. Time-to-trip

Pd typ

Rmin

R1max

Figures for

(A)

(A)

(V)

(A)

(A)

(S)

(W)

(Ω)

(Ω)

Dimension

LP-SM050

0.50

1.00

60

10

2.5

4.0

1.9

0.350

1.400

Fig.1

LP-SM110

1.10

2.20

33

40

8.0

0.5

1.9

0.100

0.480

Fig.1

LP-SM150C

1.50

3.00

33

40

8.0

5.0

2.1

0.060

0.250

Fig.2

LP-SM200C/24

2.00

4.00

24

40

8.0

12.0

2.1

0.045

0.125

Fig.2

LP-SM300C/16

3.00

6.00

16

40

8.0

35.0

1.9

0.015

0.048

Fig.2

LP-SM400C/16

4.00

8.00

16

40

8.0

40.0

1.9

0.012

0.010

Fig.2

 

IH=Hold current: maximum current at which the device will not trip at 25℃ still air.

IT=Trip current: minimum current at which the device will always trip at 25℃ still air.

Vmax=Maximum voltage device can withstand without damage at rated current.

Imax=Maximum fault current device can withstand without damage at rated voltage. 

Ttrip=Maximum time to trip at assigned current.

Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.

Rmin=Minimum device resistance at 25℃ prior to tripping.

R1max=Maximum device resistance measured after 1 hour post one-time trip.


Part Numbering System                                          

 20161024130629

Test Procedures And Requirements                                                 

 

Test

Test Conditions

Accept/Reject Criteria

Resistance

In still air @ 25℃

Rmin≤R≤Rmax

Time to Trip

Specified current, Vmax, 25℃

T≤maximum Time to Trip

Hold Current

30min, at IH

No trip

Trip Cycle Life

Vmax, Imax, 100cycles

No arcing or burning

Trip Endurance

Vmax, 24hours

No arcing or burning


Application Requirements                                                            

Soldering recommendation:

* Methods: IR, Vapor phase oven, hot air oven, wave solder, soldering temperature should not exceed GB-T2423 request.

* Devices can be cleaned using standard industry methods and solvents.

Notes:

If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Storage: 

The maximum ambient temperature shall not exceed 40℃. Storage temperatures higher than 40℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.

Warning:

PPTC devices are intended for protection against occasional over-current or over-temperature fault conditions, and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

Notes:

The specification is intended to present application, product and technical data to assist the user in selecting PPTC circuit production devices. However, users should independently evaluate and test the suitability of each product. Wayon makes no warranties as to the accuracy or completeness of the information and disclaims any liability resulting from its use. Wayon`s only obligations are those in the Wayon Standard Terms and Conditions of Sale and in no case will Wayon be liable for any incidental, indirect, or consequential damages arising from the sale, resale, or misuse of its products. Wayon reserves the right to change or update, without notice, any information contained in this specification.


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